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THERMAL VISCOUS DISSIPATIVE COUETTE FLOW IN A POROUS MEDIUM FILLED MICROCHANNEL

机译:多孔介质填充微通道中的热粘性耗散耦合流量

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The increasing demand for high-performance electronic devices and surge in power density accentuates the need for heat transfer enhancement. In this study, a thermal viscous dissipative Coeutte flow in a micochannel filled with fluid saturated porous medium is looked into. The study explores the fluid flow and heat transfer phenomenon for a Coeutte flow in a microchannel as well as to establish the relationship between the heat convection coefficient and viscous dissipation. The moving boundary in this problem is subjected to uniform heat flux while the fixed plate is assumed adiabatic. In order to simplify the problem, we consider a fully developed flow and assume local thermal equilibrium in the analysis. An analytical Nusselt number expression is developed in terms of Brinkman number as a result of this study, thus providing essential information to predict accurately the thermal performance of a microchannel. The results obtained without viscous dissipation are in close agreement with published results whereas viscous dissipation has a more significant effect on Nusselt number for a porous medium with higher porous medium shape factor. The Nusselt number versus Brinkman number plot shows an asymptotic Brinkman number, indicating a change in sign of the temperature difference between the bulk mean temperature and the wall temperature. The effects of Reynolds number on the two dimensional temperature profile for a Couette flow in a microchannel are investigated. The temperature distribution of a microscale duct particularly along the axial direction is a strong function of viscous dissipation. The significance of viscous dissipation to a microscale duct as compared to a conventional scale duct is also discussed and compared in this study.
机译:对高性能电子设备的需求越来越大,电力密度浪涌突出了热传递增强的需求。在这项研究中,研究了填充有流体饱和多孔介质的MICoChannel中的热粘性耗散串行流动。该研究探讨了微通道中的陶氏流的流体流动和传热现象,以及建立热对流系数和粘性耗散之间的关系。在该问题中的移动边界经受均匀的热通量,而固定板被认为是绝热的。为了简化问题,我们考虑一个完全发育的流动并在分析中呈现局部热平衡。根据本研究的结果,在Brinkman号方面开发了分析营养号表达式,从而提供了基本信息,以准确地预测微通道的热性能。没有粘性耗散获得的结果与公开的结果密切一致,而粘性耗散对具有较高多孔介质形状因子的多孔介质的营养数具有更大的影响。 Nusselt数与Brinkman号码图显示了渐近Brinkman号,表明散装平均温度与壁温之间的温差符号的变化。研究了雷诺数对微通道中的沟槽流动的二维温度曲线上的效果。特别是沿轴向的微尺度管道的温度分布是粘性耗散的强功能。还讨论了与传统级管道相比,粘性耗散与微尺度管道相比的重要性。

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