首页> 外文会议>ECS Meeting >A COMPARATIVE STUDY OF ERBIUM OXIDE AND GADOLINIUM OXIDE HIGH-K DIELECTRIC THIN FILMS GROWN BY LOW-PRESSURE METALORGANIC CHEMICAL VAPOUR DEPOSITION (MOCVD) USING beta-DIKETONATES AS PRECURSORS
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A COMPARATIVE STUDY OF ERBIUM OXIDE AND GADOLINIUM OXIDE HIGH-K DIELECTRIC THIN FILMS GROWN BY LOW-PRESSURE METALORGANIC CHEMICAL VAPOUR DEPOSITION (MOCVD) USING beta-DIKETONATES AS PRECURSORS

机译:低压金属化学气相沉积(MOCVD)作为前体的低压金属化学气相沉积(MOCVD)生长氧化铒和氧化钆高k介电薄膜的对比研究

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Continuing scaling down of CMOS-based devices leads to the serious problem of gate leakage (tunneling) current. Various materials, such as Al-2O-3, HfO-2, Ta-2O-5 etc., are currently under consideration as candidates for alternative gate dielectric for the next generations of CMOS-based devices [1]. In the same vein, erbium oxide (Er-2O-3) and gadolinium oxide (Gd-2O-3) also have been examined, because they offer a higher dielectric constant (epsilon~14) than does SiO-2 (epsilon~ 3.9), large band gap (~5.6eV), as well as thermodynamical and chemical stability with silicon [2-5].
机译:继续缩放基于CMOS的设备导致栅极泄漏(隧道)电流的严重问题。目前正在考虑各种材料,例如Al-2O-3,HFO-2,TA-2O-5等,作为下一代基于CMOS的器件的替代栅极电介质的候选者[1]。在相同的静脉中,还研究了氧化铒(ER-2O-3)和氧化钆(GD-2O-3),因为它们提供比SiO-2更高的介电常数(epsilon〜14)(epsilon〜3.9 ),大带隙(〜5.6eV),以及硅的热力学和化学稳定性[2-5]。

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