Effect of mechanical properties of gold wire on looping behavior and pull strength for QFN Stacked Die Package

摘要

Gold is commonly used in the field of electronic manufacturing as bonding wire that connects the IC chip and circuit board. The effect of trace elements on the mechanical properties of 4N gold wire has not been widely investigated for some years despite the important of wire-bonding and the move towards fine pitch applications. The objective of this study is to determine the effect of mechanical properties of two type of gold wire (wire A and wire B) on looping and pull strengths. Both wires with diameter of 25.4μm were bonded using K&S Maxum by maintaining the temperature at 200°C. Due to the element analysis, atomic percentage of Ca in wire B is higher than wire A. Pull strength increase with the increasing of the trace element. The higher pull strength of wire B could improve the yield strength, elastic modulus and recrytallization temperature.