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An Efficient Dynamic Power Estimation Method for On-chip VLSI Interconnects

机译:片上VLSI互连的有效动态功率估算方法

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As the size of transistor is decreasing, more number of functionalities are integrated onto a single chip, so the interconnect length is ever increasing. Signal rise time is decreasing as compared to the time of flight. Hence, the interconnect can no longer be modelled as RC tree, rather it must be modelled as a transmission line by taking the inductance into account. With the increase in frequency, the dynamic power dissipation associated with interconnect is also increasing. Hence, an efficient method to estimate the interconnect power dissipation is necessary. In this paper, a simple yet accurate method has been proposed to estimate dynamic power dissipation of on-chip interconnect. A reduced order model is derived. The proposed model is directly derived from total resistance, inductance and capacitance of interconnects. Through the analysis made in this paper, it is shown that the dynamic power dissipation for the interconnects can be accurately estimated. The results of the proposed method applied to various RLC networks show that maximum relative error is within 4 to 6% compared to the SPICE results.
机译:随着晶体管尺寸的减小,更多的功能集成到单个芯片上,因此互连长度不断增加。与飞行时间相比,信号上升时间正在减少。因此,不能再将互连建模为RC树,而必须通过考虑电感将其建模为传输线。随着频率的增加,与互连相关的动态功耗也在增加。因此,需要一种有效的方法来估计互连功耗。本文提出了一种简单而准确的方法来估算片上互连的动态功耗。推导了降阶模型。所提出的模型直接从互连的总电阻,电感和电容得出。通过本文的分析表明,可以准确估计互连的动态功耗。所提出的方法应用于各种RLC网络的结果表明,与SPICE结果相比,最大相对误差在4%至6%之内。

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