Abstract: Modern microelectronics, microsystems (MEMS and MOEMS) and their components are characterized by high volume integration of a variety of materials and combinations of materials to realize very different and variable functions (sensor and actuator functions, signal processing, etc.). The reliability and the lifetime of these microproducts are strongly depending on the material properties and the thermo-mechanical design. So nondestructive optical measuring and inspection methods are widely used in the R&D process, in IC-fabrication, in manufacturing and in packaging of MEMS and microcomponents. In following some special applications are described. !9
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