Abstract: In this paper the methodology and instrumentation for the investigation of the silicon microbeam behavior under tensile and bending loads are described. The tests are performed by means of Automated Grating Interferometry (AGI) and Digital Holography (DH). Both methods deliver a direct approach to a highly sensitive measurement of surface displacements. In combination with simulation tools (analytical or FEM models) the material parameters can be determined. Consequently the main aim of the measurements is to determine the three Cartesian components of the displacement vector. !14
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