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SIMULATION STUDY ON BREAKDOWN BEHAVIOR OF FIELD- PLATE SiC MESFETs

机译:场板SiC MESFET击穿行为的模拟研究

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摘要

The effects of field-plate structures on SiC MESFETs were investigated using two-dimensional simulations. The simulation results without a field-plate were in good agreement with the characteristics of fabricated SiC MESFETs. The breakdown voltage was increased by 80 % when the optimum field-plate was applied to the device with a 0.5 μm long gate and a 1 μm spacing between gate and drain; a breakdown voltage of 240 - 250 V was obtained from a 0.35 μm field-plate, while 140 V was obtained without a field-plate.
机译:使用二维仿真研究了场板结构对SiC MESFET的影响。没有场板的仿真结果与制造的SiC MESFET的特性非常吻合。当将最佳场板应用于栅极长度为0.5μm,栅极和漏极之间的距离为1μm的器件时,击穿电压提高了80%。从0.35μm的场板获得240-250 V的击穿电压,而没有场板则获得140V。

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