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Analytical model for TDDB-based performance degradation in combinational logic

机译:组合逻辑中基于TDDB的性能下降的分析模型

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With aggressive gate oxide scaling, latent defects in the gate oxide manifest as traps that, in time, lead to gate oxide breakdown. Progressive gate oxide breakdown, also referred to as time-dependent dielectric breakdown (TDDB), is emerging as one of the most important sources of performance degradation in nanoscale CMOS devices. This paper describes an accurate analytical model to predict the delay of combinational logic gates subject to TDDB. The analytical model can be seamlessly integrated into a static timing analysis tool to analyze TDDB effects in large combinational logic circuits across a range of supply voltages and severity of oxide breakdown. Simulation results for an early version of an industrial 32 nm library show that the model is accurate to within 3% of SPICE with orders of magnitude improvement in runtime.
机译:随着激进的栅氧化物结垢,栅氧化物中的潜在缺陷表现为陷阱,这些陷阱随时间导致栅氧化物击穿。逐步栅氧化层击穿,也称为随时间变化的介电击穿(TDDB),正在成为纳米级CMOS器件性能下降的最重要来源之一。本文描述了一种精确的分析模型,以预测受TDDB约束的组合逻辑门的延迟。可以将分析模型无缝集成到静态时序分析工具中,以分析跨电源电压范围和氧化物击穿严重性的大型组合逻辑电路中的TDDB效应。早期版本的工业32 nm库的仿真结果表明,该模型的准确度达到SPICE的3%以内,并且运行时间有所改善。

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