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Multi-temperature testing for core-based system-on-chip

机译:基于内核的片上系统的多温度测试

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Recent research has shown that different defects can manifest themselves as failures at different temperature spectra. Therefore, we need multi-temperature testing which applies tests at different temperature levels. In this paper, we discuss the need and problems for testing core-based systems-on-chip at different temperatures. To address the long test time problem for multi-temperature test, we propose a test scheduling technique that generates the shortest test schedules while keeping the cores under test within a temperature interval. Experimental results show the efficiency of the proposed technique.
机译:最近的研究表明,不同的缺陷会在不同的温度范围内表现为故障。因此,我们需要进行多温度测试,以便在不同的温度水平下进行测试。在本文中,我们讨论了在不同温度下测试基于内核的片上系统的需求和问题。为了解决多温度测试的测试时间长的问题,我们提出了一种测试计划技术,该技术可生成最短的测试计划,同时将被测铁芯保持在一个温度区间内。实验结果表明了该技术的有效性。

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