Thermal Characterization of Tape BGA Package by Modeling

摘要

In microelectronic industry, numerical modeling is an effective way to predict thermal performance of IC packages in the initial development stage. Moreover, thermal simulation can provide a greater understanding of the physics of the problem, allowing designs to be optimized quickly and cheaply, thereby shortening packaging development cycle time and keeping expensive experimental measurements to a minimum. In this study, 3-D finite element analysis (FEA) thermal models capturing the details of the solder ball and internal structure of the tape BGA (TBGA) package are developed. Accuracy of the developed FEA models is validated by benchmarking with the measurement for 35mmx35mm 352 TBGA package. Numerical results of the thermal performance of the TBGA package under various die size and heat-spreader remaining thickness are presented. The thermal metrics, Theta-JA (θ_(ja)), Psi-JT(ψ_(JT)), and Psi-JB(ψ_(JB)), of the package are characterized numerically. Relationships between these three thermal metrics (θ_(ja), ψ_(JT) and ψ_(JB)) are established. These relationships are useful to correlate one thermal parameter of the package to another.