High-Yield Triple-Stack Bonding Fabrication Process For Micromachined Micromotors With Contactless Rotor

摘要

Anodic bonding process is widely used in fabrication of micromachined devices. In order to improve the yield and quality of micromachined devices with movable structures, this paper demonstrates a glass-silicon-glass triple-stack anodic bonding strategy by applying multi-step low-bonding voltages. An optimized bonding parameter was analyzed and implemented on a micromachined electrostatic micromotor with a contactless ring-shaped rotor. Experimental results indicate a significant improvement on the yield of the free-rotor micromotor benefiting from such improved bonding process.