摘要：
With functional polyimide as matrix material and hollow glass microspheres as filler,polyamide acid solution was synthesized by in-situ polymerization,and the hollow glass microspheres (HGM)/polyimide (PI) composite films with different HGM contents were prepared by casting.Then the effect of HGM contents on the mechanical properties,dielectric performances and thermal stability of the PI composite film was investigated.The results show that the addition of HGM can improve the thermal stability of the composite film,of which the glass transition temperature is about 363 °C.With the increasing of HGM content,the tensile strength reaches the maximum with the 3％ HGM addition,while its elastic modulus has a rising trend.With the change of the addition of hollow glass microspheres,breakdown strength remains a high value.With the increase of the mass content of the hollow glass microspheres,the dielectric constant of the polyimide composite film decreases.When its content is 9％,dielectric constant can be reduced by about 70％ and the dielectric loss is less than 0.05,so the hollow glass microspheres/polyimide composite film shows excellent low dielectric properties.%以功能性聚酰亚胺为基体,空心玻璃微球为填料,采用原位聚合法合成聚酰胺酸溶液,流延成膜,制备了不同含量的空心玻璃微球/聚酰亚胺复合薄膜,研究了不同空心玻璃微球含量对复合薄膜力学性能、介电性能和热稳定性能的影响.结果表明,空心玻璃微球的加入能够保持复合薄膜的热稳定性,其玻璃化转变温度在363°C左右;复合薄膜的弹性模量处于上升的趋势,当空心玻璃微球的质量分数为3％左右时拉伸强度达到最大;同时随着空心玻璃微球含量的增加,击穿强度依然保持在很高的数值;空心玻璃微球含量增加时,复合薄膜的介电常数出现降低的趋势,当含量达到9％时,薄膜的介电常数可以降低70％左右,同时介电损耗因数在0.05以下,表现为较为优异的低介电性能.
