POP

摘要： 2021年早已过去,这一年有哪些书值得被关注和阅读呢?1Whether you're looking for a new release from an adored author or a timely read,these books are popular in 2021.People We Meet on Vacation by Emily Henry 2 Alex and Poppy couldn't be more opposite:Alex.

摘要： 高可靠性POP工艺的GNC模块,采用了无框架结构,以三维互连为层规划准则,集成了信息处理组件和多种传感器,通过三维堆叠实现了立体互连,形成具有多种外设接口的正交立体集成结构的导航制导通信模块;然而,由于其高集成度和小型化的特点,导致其存在测试难度大、测试耗时长等问题。针对以上问题,文章采用主从协同系统设计方法,构建了一种针对小型化航天电子产品的新型测试系统,测试系统硬件部分采用小型化、嵌入式设计,实现对产品在特殊环境条件下的测试;软件架构采用分层构件化设计,将单元测试和专项测试相结合,对产品各项功能和性能实行独立测试;经实际应用证明满足对GNC产品的测试需求,该测试系统功能齐全,操作简单,利于总体维护及系统级调试,功能测试时间仅需8~10秒,将工作效率提升了50%,是对GNC模块可测性、可算性的巨大提升。

摘要： 在经济蓬勃发展和文化多元碰撞的背景下,基于Z世代趣缘社群的潮玩IP和盲盒经济应运而生。本文以“盲盒第一股”泡泡玛特(POPMART)的研究为基础,从管理学、经济学、心理学和社会学等多个角度,综合运用商业模式理论、价值理论、马斯洛需求与动机理论等多种理论从盲盒全产业链对POPMART的商业模式、盈利模式进行了全面研究,根据实地调查,深入剖析盲盒兴起的原因和盲盒潮玩产业价值创造与价值获取机理;探讨盲盒消费者的心理特征及Z世代趣缘社群的亚文化社会意义;探究盲盒火爆背后所隐藏的问题并就盲盒经济的发展提出可行建议,以期为提高各市场主体责任意识、引导盲盒行业规范有序发展提供借鉴。

摘要： The average age of the global population has risen steadily since the 20th Century.The century from 1950 to 2050 is unprecedented for human population.The first half of the century witnessed rapid population growth while the second half will see longer life expectancy.In 1999,the proportion of people aged 60 and over in China reached 10 percent,marking the dawn of its aging society.In 2019,the proportion of people aged 60 and over reached 18.1 percent.As population aging continues,the impact on economic and social development will be comprehensive,profound,and lasting.

摘要： 你对K-POP有什么了解? K-POP是来自韩国的流行音乐。娱乐公司挑选有才华的年轻人,然后组成团队并且训练他们。这些团队和艺人必须非常努力,这样他们表演的时候,就能炫耀自己的技艺。K-POP爱好者都疯狂热爱他们。K-POP风靡全世界,许多人喜欢K-POP的音乐、有趣的舞蹈和酷炫的音乐视频。K-POP虽然通常都用韩语演唱,但非韩国歌迷还是听得很享受。

摘要： 女性盆腔器官脱垂(POP)是由多种因素导致的盆底支持结构薄弱,伴随一系列临床症状的疾病,属于盆底功能障碍性疾病(PFD)的范畴,是绝经后女性最常见的一类疾病.随着我国进入老龄化社会,其发病率呈日益增长趋势,已严重影响中老年女性生活质量及身心健康.POP的治疗分为非手术与手术治疗.非手术治疗主要有药物治疗、子宫托、盆底肌肉锻炼、物理疗法等.随着盆底研究的发展,POP手术逐渐多样化,由传统术式转变为盆底重建术、悬吊术等新术式,个体化的治疗,使患者得到满意的治疗效果.本文就女性盆腔器官脱垂的发病机制及国内外治疗进展进行综述.

摘要： 伴随着BIM技术的推广,建设项目VDC理念也逐渐得到实践.本文阐述了VDC框架下的POP模型,并且结合浦东美术馆项目中的案例实践,论述了VDC/BIM技术在项目设计和施工过程中的应用价值.

摘要： 中国的"流行音乐"这一术语是由"popular music"一词翻译而来的.从词源学角度来讲,"pop"一词为"popular"一词的缩写形式,但在流行音乐领域所含意义却有不同.从某种程度上讲,"popular music"通常指较宏观的音乐类别;"pop"则是指20世纪50年代以后迅速兴盛的更为具体的音乐风格.本文通过对《新格罗夫音乐与音乐家词典》以及其他相关文献中有关"pop"与"popular music"等相关词条的研究,试图对这两个术语的概念做出辨析,并最终对两个术语的汉译归属问题以及流行音乐术语的汉译方法进行探索.

摘要： Listen!Can you hear the neigh(嘶鸣)of the horses?It is a horse racing(赛马)in Longchamp!Longchamp is located in a large park in western Paris,France.The first race run there was in 1857.After that,horse racing became very popular in France.Many artists were fond of it.They usually showed races from the side.

摘要： 为加强邮件收发安全性,我刊主管单位中国石油化工集团公司的邮件系统不再提供POP/SMTP协议服务。为保障我刊网站邮件功能的正常使用,编辑部在保留原邮箱hghb.bjhy@sinopec.com的基础上,增设新邮箱huagonghuanbao@163.com用于对外联络。新邮箱所发邮件与原邮箱具有同等效力。特此通告。望周知。

摘要： 聚醚多元醇是生产聚氨酯(PU)制品的主要原料.聚醚多元醇可归纳为三种类型:一种是以多元醇或有机胺为起始剂与环氧丙烷(PO)或环氧丙烷(PO)和环氧乙烷(EO)的聚合物,通称为PPG(聚醚多元醇),这种产品在PU中用量最大.另一种是聚合物多元醇,它以PPG为基础,然后用乙烯基单体,如丙烯腈(AN)或(和)苯乙烯(SN)等在多元醇中经本体聚合反应而制得,称为POP(聚合物聚醚多元醇),POP不单独使用,而与PPG配合使用,以赋予PU制品优良性能.第三种类型聚醚多元醇是聚四亚甲基醚乙二醇(PTMEG,又称聚四氢呋喃型多元醇),是由四氢呋喃开环聚合而成,主要应用于PU弹性体和PU纤维.本文分析了聚醚多元醇国内外市场，并就其发展前景进行预测.

摘要： 聚醚多元醇是生产聚氨酯(PU)制品的主要原料.聚醚多元醇可归纳为三种类型:一种是以多元醇或有机胺为起始剂与环氧丙烷(PO)或环氧丙烷(PO)和环氧乙烷(EO)的聚合物,通称为PPG(聚醚多元醇),这种产品在PU中用量最大.另一种是聚合物多元醇,它以PPG为基础,然后用乙烯基单体,如丙烯腈(AN)或(和)苯乙烯(SN)等在多元醇中经本体聚合反应而制得,称为POP(聚合物聚醚多元醇),POP不单独使用,而与PPG配合使用,以赋予PU制品优良性能.第三种类型聚醚多元醇是聚四亚甲基醚乙二醇(PTMEG,又称聚四氢呋喃型多元醇),是由四氢呋喃开环聚合而成,主要应用于PU弹性体和PU纤维.本文分析了聚醚多元醇国内外市场，并就其发展前景进行预测.

摘要： 聚醚多元醇是生产聚氨酯(PU)制品的主要原料.聚醚多元醇可归纳为三种类型:一种是以多元醇或有机胺为起始剂与环氧丙烷(PO)或环氧丙烷(PO)和环氧乙烷(EO)的聚合物,通称为PPG(聚醚多元醇),这种产品在PU中用量最大.另一种是聚合物多元醇,它以PPG为基础,然后用乙烯基单体,如丙烯腈(AN)或(和)苯乙烯(SN)等在多元醇中经本体聚合反应而制得,称为POP(聚合物聚醚多元醇),POP不单独使用,而与PPG配合使用,以赋予PU制品优良性能.第三种类型聚醚多元醇是聚四亚甲基醚乙二醇(PTMEG,又称聚四氢呋喃型多元醇),是由四氢呋喃开环聚合而成,主要应用于PU弹性体和PU纤维.本文分析了聚醚多元醇国内外市场，并就其发展前景进行预测.

摘要： 聚醚多元醇是生产聚氨酯(PU)制品的主要原料.聚醚多元醇可归纳为三种类型:一种是以多元醇或有机胺为起始剂与环氧丙烷(PO)或环氧丙烷(PO)和环氧乙烷(EO)的聚合物,通称为PPG(聚醚多元醇),这种产品在PU中用量最大.另一种是聚合物多元醇,它以PPG为基础,然后用乙烯基单体,如丙烯腈(AN)或(和)苯乙烯(SN)等在多元醇中经本体聚合反应而制得,称为POP(聚合物聚醚多元醇),POP不单独使用,而与PPG配合使用,以赋予PU制品优良性能.第三种类型聚醚多元醇是聚四亚甲基醚乙二醇(PTMEG,又称聚四氢呋喃型多元醇),是由四氢呋喃开环聚合而成,主要应用于PU弹性体和PU纤维.本文分析了聚醚多元醇国内外市场，并就其发展前景进行预测.

摘要： 聚醚多元醇是生产聚氨酯(PU)制品的主要原料.聚醚多元醇可归纳为三种类型:一种是以多元醇或有机胺为起始剂与环氧丙烷(PO)或环氧丙烷(PO)和环氧乙烷(EO)的聚合物,通称为PPG(聚醚多元醇),这种产品在PU中用量最大.另一种是聚合物多元醇,它以PPG为基础,然后用乙烯基单体,如丙烯腈(AN)或(和)苯乙烯(SN)等在多元醇中经本体聚合反应而制得,称为POP(聚合物聚醚多元醇),POP不单独使用,而与PPG配合使用,以赋予PU制品优良性能.第三种类型聚醚多元醇是聚四亚甲基醚乙二醇(PTMEG,又称聚四氢呋喃型多元醇),是由四氢呋喃开环聚合而成,主要应用于PU弹性体和PU纤维.本文分析了聚醚多元醇国内外市场，并就其发展前景进行预测.

摘要： In 2007 Lead Free Package POP (Package on Package) will be a major new device to hit the streets this year and will challenge many to re-evaluate their soldering and rework products/processes.The implementation of lead-free in the commercial world and is well on the way in assembly plants worldwide and particularly in Asia. This represents a major logistics risk to commercial and aerospace community, while some are currently exempt from Lead Free legislation, they will be impacted by the use of Commercial off-The Shelf components finished with Lead Free component finishes. All POP is Lead free that I have seen. So if new POP memory devices are to be used in military equipments they will be lead free.Lead Free soldered electronics hardware requires higher processing temperatures than for traditional Tin Lead soldered hardware.The higher Lead Free soldering processing temperatures, coupled with faster production requirements increases the risk of board and component damage therefore requiring greater process control. The POP is another example of increased complexity especially in rework.Component manufacturers are all looking for new innovative ways to gain market share particularly in memory and products that reduce space on PCB are one way forward. There are two ways to reduce space one is reduce the pitch of the part to get more solder connections in the same array in the same space. Reducing space has been a constant theme for years now BGA/CSP have reduced the pitches for years down to mainstream BGA being 1.27mm and 1.00mm pitch. CSP have reduced to .8mm and.5 mm mainstream Future trends will go even lower to .8mm BGA and .4mm CSP.These are the assembly limits for current high volume assembly of electronic PCB Mainstream today.The next way to increase component density and performance is to go vertically. This is called POP Package on package, this is a Bga mounted on top of the other one. In some cases, component manufacturers are manufacturing up to four parts vertically for memory modules. The POP is being used in pitches of 1.0mm and 1.27mm for BGA with csp packages using 5.mm and .4mm pitch parts stacked vertically.The third way for component manufactures to increase sales is to mix DDR Ram and logic in one device i.e. POP.Alternatively designers can mix manufactures of Sram and Dram,or flash ram, and create their own specific package by making a custom POP from two different sources.This is sometimes a cost effect solution.

摘要： In 2007 Lead Free Package POP (Package on Package) will be a major new device to hit the streets this year and will challenge many to re-evaluate their soldering and rework products/processes.The implementation of lead-free in the commercial world and is well on the way in assembly plants worldwide and particularly in Asia. This represents a major logistics risk to commercial and aerospace community, while some are currently exempt from Lead Free legislation, they will be impacted by the use of Commercial off-The Shelf components finished with Lead Free component finishes. All POP is Lead free that I have seen. So if new POP memory devices are to be used in military equipments they will be lead free.Lead Free soldered electronics hardware requires higher processing temperatures than for traditional Tin Lead soldered hardware.The higher Lead Free soldering processing temperatures, coupled with faster production requirements increases the risk of board and component damage therefore requiring greater process control. The POP is another example of increased complexity especially in rework.Component manufacturers are all looking for new innovative ways to gain market share particularly in memory and products that reduce space on PCB are one way forward. There are two ways to reduce space one is reduce the pitch of the part to get more solder connections in the same array in the same space. Reducing space has been a constant theme for years now BGA/CSP have reduced the pitches for years down to mainstream BGA being 1.27mm and 1.00mm pitch. CSP have reduced to .8mm and.5 mm mainstream Future trends will go even lower to .8mm BGA and .4mm CSP.These are the assembly limits for current high volume assembly of electronic PCB Mainstream today.The next way to increase component density and performance is to go vertically. This is called POP Package on package, this is a Bga mounted on top of the other one. In some cases, component manufacturers are manufacturing up to four parts vertically for memory modules. The POP is being used in pitches of 1.0mm and 1.27mm for BGA with csp packages using 5.mm and .4mm pitch parts stacked vertically.The third way for component manufactures to increase sales is to mix DDR Ram and logic in one device i.e. POP.Alternatively designers can mix manufactures of Sram and Dram,or flash ram, and create their own specific package by making a custom POP from two different sources.This is sometimes a cost effect solution.

摘要： In 2007 Lead Free Package POP (Package on Package) will be a major new device to hit the streets this year and will challenge many to re-evaluate their soldering and rework products/processes.The implementation of lead-free in the commercial world and is well on the way in assembly plants worldwide and particularly in Asia. This represents a major logistics risk to commercial and aerospace community, while some are currently exempt from Lead Free legislation, they will be impacted by the use of Commercial off-The Shelf components finished with Lead Free component finishes. All POP is Lead free that I have seen. So if new POP memory devices are to be used in military equipments they will be lead free.Lead Free soldered electronics hardware requires higher processing temperatures than for traditional Tin Lead soldered hardware.The higher Lead Free soldering processing temperatures, coupled with faster production requirements increases the risk of board and component damage therefore requiring greater process control. The POP is another example of increased complexity especially in rework.Component manufacturers are all looking for new innovative ways to gain market share particularly in memory and products that reduce space on PCB are one way forward. There are two ways to reduce space one is reduce the pitch of the part to get more solder connections in the same array in the same space. Reducing space has been a constant theme for years now BGA/CSP have reduced the pitches for years down to mainstream BGA being 1.27mm and 1.00mm pitch. CSP have reduced to .8mm and.5 mm mainstream Future trends will go even lower to .8mm BGA and .4mm CSP.These are the assembly limits for current high volume assembly of electronic PCB Mainstream today.The next way to increase component density and performance is to go vertically. This is called POP Package on package, this is a Bga mounted on top of the other one. In some cases, component manufacturers are manufacturing up to four parts vertically for memory modules. The POP is being used in pitches of 1.0mm and 1.27mm for BGA with csp packages using 5.mm and .4mm pitch parts stacked vertically.The third way for component manufactures to increase sales is to mix DDR Ram and logic in one device i.e. POP.Alternatively designers can mix manufactures of Sram and Dram,or flash ram, and create their own specific package by making a custom POP from two different sources.This is sometimes a cost effect solution.

摘要： In 2007 Lead Free Package POP (Package on Package) will be a major new device to hit the streets this year and will challenge many to re-evaluate their soldering and rework products/processes.The implementation of lead-free in the commercial world and is well on the way in assembly plants worldwide and particularly in Asia. This represents a major logistics risk to commercial and aerospace community, while some are currently exempt from Lead Free legislation, they will be impacted by the use of Commercial off-The Shelf components finished with Lead Free component finishes. All POP is Lead free that I have seen. So if new POP memory devices are to be used in military equipments they will be lead free.Lead Free soldered electronics hardware requires higher processing temperatures than for traditional Tin Lead soldered hardware.The higher Lead Free soldering processing temperatures, coupled with faster production requirements increases the risk of board and component damage therefore requiring greater process control. The POP is another example of increased complexity especially in rework.Component manufacturers are all looking for new innovative ways to gain market share particularly in memory and products that reduce space on PCB are one way forward. There are two ways to reduce space one is reduce the pitch of the part to get more solder connections in the same array in the same space. Reducing space has been a constant theme for years now BGA/CSP have reduced the pitches for years down to mainstream BGA being 1.27mm and 1.00mm pitch. CSP have reduced to .8mm and.5 mm mainstream Future trends will go even lower to .8mm BGA and .4mm CSP.These are the assembly limits for current high volume assembly of electronic PCB Mainstream today.The next way to increase component density and performance is to go vertically. This is called POP Package on package, this is a Bga mounted on top of the other one. In some cases, component manufacturers are manufacturing up to four parts vertically for memory modules. The POP is being used in pitches of 1.0mm and 1.27mm for BGA with csp packages using 5.mm and .4mm pitch parts stacked vertically.The third way for component manufactures to increase sales is to mix DDR Ram and logic in one device i.e. POP.Alternatively designers can mix manufactures of Sram and Dram,or flash ram, and create their own specific package by making a custom POP from two different sources.This is sometimes a cost effect solution.

摘要： 本发明提供了一种激光实现POP接合的方法及其POP结构。其采用两个导线弧进行软性接合，相较于导电柱的刚性接合具有更高的适应度，可以匹配不同的芯片高度和封装体高度之间的接合。

摘要： 公开了用于封装体叠层（PoP）组件的下集成电路（IC）封装结构的实施例。下IC封装结构包括具有与上IC封装的端子配合的焊盘的插入体。将密封剂材料设置到下IC封装中，可以将这一密封剂设置为邻近一个或多个IC管芯。可以使上IC封装与下IC封装耦合以形成PoP组件。可以将这种PoP组件设置到主板或其他电路板上，或者其可以形成计算系统的部分。还描述了其他实施例，并要求对其进行保护。

摘要： 本发明公开了用于CO2催化加氢制甲醇的Pt/POP催化剂及其制备方法，涉及催化剂设计领域，所述Pt/POP催化剂是以多孔有机聚合物为载体均匀负载3wt％的Pt而成，其制备过程包括如下步骤：(1)将多孔有机聚合物POP加入H2PtCl6甲醇溶液中，在70～80°C搅拌12h；(2)在上述溶液中添加5倍POP质量的NaBH4，然后搅拌1h；(3)将上述溶液过滤，用水和乙醇清洗，并在50～60°C下真空干燥12h，即可得到Pt/POP催化剂。本发明制备的Pt/POP催化剂，本发明制备的Pt/POP催化剂，POP比表面积大，并且能够通过NaBH4还原Pt，使得Pt颗粒均匀的负载在POP，使得活性中心能够更好地暴露，进而提高催化活性。

摘要： 本发明涉及半导体封装技术领域，提出一种POP封装结构及其构造方法。该结构包括：第一基板和第二基板；第一芯片，其布置于所述第一基板上；第二芯片，其布置于所述第二基板上；以及相变材料，其包覆所述第二芯片，其中所述相变材料被配置为吸收所述第二芯片工作产生的热量，并且由固相转化为液相以便将热量导出。本发明可以很好地满足高功耗芯片对封装高效散热的要求，在电子封装领域具有极大的应用价值。

摘要： 本发明属于重金属‑持久性有机物复合污染土壤处理技术领域，具体为一种重金属‑POPs复合污染土壤的机械化学修复方法。该方法具体步骤如下：首先，将自然风干的重金属复合污染土壤粗碎过筛，然后将筛分后的污染土壤、修复助剂以及氧化锆磨球按比例置于氧化锆球磨罐内于行星式球磨机中进行机械化学球磨反应。本发明通过外加修复助剂的机械化学球磨反应，将污染土壤中重金属从易迁移的离子形态转化为稳定的难溶态而实现其固化稳定化，同时将污染土壤中POPs有机物进行脱卤、苯环开环而实现其高效降解。本发明方法具有操作简单、清洁高效且无二次污染的优点，是一种具有良好前景的重金属‑POPs复合污染土壤的修复方法。

摘要： 本发明涉及半导体封装技术领域，提出一种用于POP封装的散热结构及其构造方法。所述散热结构包括第一基板和第二基板；第一芯片，其布置于所述第一基板上；第二芯片，其布置于所述第二基板上；以及微流道，其与所述第一和第二芯片连接并且将所述第一和第二芯片工作生成的热量导出。

摘要： 本发明公开了一种消除音频切换引起POP音的方法和装置，方法包括如下步骤：S1、音频控制程序录制，所述音频控制程序用于控制音频输出端的音量淡入时长；S2、耳机连接，将耳机通过蓝牙与手机进行连接；S3、记录音频状态；S4、根据不同音频状态转换进行POP音消除，选择音频控制程序中不同的淡入时长进行淡入。本发明通过耳机端检测通话、音乐播放及语言助手的状态，并通过耳机端实现通话到音频的POP音控制过程，而且淡入过程的时间具有自适应性；如果一直是音乐播放，则无淡入过程；如果是通话到音频播放，则增大淡入时间；如果是语言助手到音频播放，则减小淡入时间，有效的解决了手机在音频状态转换时产生的POP音。

摘要： 本申请公开一种基于POP3协议的上网认证方法及系统，系统包括：终端设备、交换机、认证设备以及POP3服务器；其中终端设备接入交换机后与认证设备通信连接，认证设备与POP3服务器通信连接。本申请通过配置认证设备支持POP3认证，可灵活选择使用邮箱提供商邮箱，也可选择内网邮箱，且用户账号直接可用，不需要额外配置账号，方便管理。本申请还配置地址池地址，使用哈希链表对地址池地址进行使用率的统计以及按照使用率对地址池地址排序，使得终端设备可以通过POP3协议上网认证的同时，确保了大量终端设备使用同一IP地址认证时，可以通过地址池地址分散IP地址，减少被服务器判定是攻击行为而拒绝服务，极大提升了使用体验。

摘要： 本实用新型提供一种POP封装结构和一种POP封装堆叠结构。POP封装结构包括：相对设置的第一基板和第二基板；第一基板上设置有第一芯片，第二基板上设置有第二芯片，第一芯片和第二芯片均设置于第一基板和第二基板之间，且第一芯片的背面与第二芯片的背面相对设置。本实用新型的POP封装结构的电连接选择形式更加多样化，更加自由，有利于多种封装结构的堆叠。且本实用新型的POP封装结构能够同时对两个基板中间的第一芯片和第二芯片形成保护，安全性高。

摘要： 本申请涉及一种妇科检查器具，尤其涉及一种应用于POP‑Q的可滑动硅胶尺；其包括外筒和能匹配穿过外筒的内芯；外筒前端面设有卡环，内芯的末端设有环形的外挡圈，内芯的前部连接有薄膜指套，内芯上标示有刻度线，刻度线的0刻线为内芯前端面。由于实施上述技术方案，本申请对产后42天产妇和已婚女性进行盆腔器官有无脏器脱垂或发生脏器脱垂的程度进行检查时，使用卡环固定在阴道口处女膜缘处，上标示有刻度线的内芯作为测量工具，外筒与内芯的配合即可做出精准诊断；解决了在测量中检查者主观的移动和阻力，消除了使用直尺外套一次性薄膜手套的干扰和检查者检查时在指尖至手指上标记处的距离用直尺测量的误差。