美国电子电路和电子互连行业协会_国内外标准网文献检索下载

1.[标准] Requirements for Soldering Fluxes

焊剂要求

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
历史

标准号：
IPC J-STD-004C

发布时间：
2022-01-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes.
2.[标准] Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

高频（微波）印制板的鉴定和性能规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 6018D

发布时间：
2022-02-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.
3.[标准] Terms and Definitions for the Design and Manufacture of Printed Electronics

印刷电子产品设计和制造的术语和定义

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC T-51

发布时间：
2022-04-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This standard provides terms and definitions for the design and manufacture of printed electronics.
4.[标准] Specification for Flexible Base Dielectrics for Use in Flexible Printed Boards

柔性印制板用柔性基电介质规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 4202C

发布时间：
2022-01-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed boards.
5.[标准] Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP)

红色鼠疫控制计划（RPCP）的制定和实施指南

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC WP-113A

发布时间：
2021-10-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This document introduces design concepts, guidelines, procedures, practices, process attributes, and recommendations for the control and mitigation of performance and reliability risks associated with the use of silver-coated copper conductors and technology in the manufacture of electrical and electronic assemblies, including optical and metallic cable and wiring harness assemblies, and elements thereof.
6.[标准] Specification for Finished Fabric Woven from 'E' Glass for Printed Boards

印制板用“E”玻璃织成的成品织物规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 4412C

发布时间：
2021-09-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This specification covers finished fabrics woven from E glass electrical grade glass fiber yarns that are intended as a reinforcing material laminated plastics for electrical and electronic use. All fabrics covered by this specification are plain weave.
7.[标准] Requirements for Electrical Testing of Flexible Printed Electronics

柔性印刷电子产品的电气试验要求

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 9257

发布时间：
2021-02-01

中标分类：
-

国标分类：
-

实施时间：

摘要： The IPC-9257 standard assists in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on flexible printed electronics. Electrical testing of flexible printed electronics ensures conformance to electrical design requirements specified in IPC-6902. The IPC-9257 standard defines different levels of testing available to achieve this purpose.
8.[标准] Trusted Electronic Designer, Fabricator and Assembler Requirements

可信赖的电子设计师、制造商和组装商要求

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
历史

标准号：
IPC 1791B

发布时间：
2021-08-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management(SCRM), security and chain of custody (ChoC).
9.[标准] Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

印制板用化学镀镍/浸金（ENIG）规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 4552B

发布时间：
2021-07-27

中标分类：
-

国标分类：
-

实施时间：

摘要： IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
10.[标准] Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan

异物碎片（FOD）控制计划的制定和实施指南

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC WP-116A

发布时间：
2021-10-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This document introduces design concepts, attributes, and recommendations for the control and mitigation of performance and reliability risks associated with the introduction of Foreign Object Debris (FOD) in electrical and electronic (E/E) assemblies, including optical and metallic cable and wiring harness assemblies, and elements thereof.
11.[标准] Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry

包含嵌入式有源和无源电路的印制板的鉴定和性能规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 6017A

发布时间：
2021-08-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This specification covers qualification and performance of embedded active and passive circuitry within the finished printed board.
12.[标准] Qualification and Performance Specification for Printed Electronics on Flexible Substrates

柔性基板上印刷电子产品的鉴定和性能规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 6902

发布时间：
2021-03-08

中标分类：
-

国标分类：
-

实施时间：

摘要： The IPC-6902 standard establishes and defines the qualification and performance requirements for printed electronics and the forms of component mounting and interconnecting structures on flexible substrates.
13.[标准] Design and Critical Process Requirements for Cable and Wiring Harnesses, Includes IPC-WP-113A, IPC-WP-114A, and IPC-WP-116A

电缆和线束的设计和关键工艺要求

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC D-620A

发布时间：
2021-12-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This document provides design and critical process requirements and technical insight that have been removed from the acceptance standards for cable and wire harness assemblies. Reference materials listed in this text are among those considered as required reading. The User is encouraged to obtain all relevant referenced materials as this document cannot (nor can any single document) cover every material, process, environment, performance, or safety aspect that affect a given design.
14.[标准] Terms and Definitions for Interconnecting and Packaging Electronic Circuits

互连和封装电子电路的术语和定义

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC T-50N

发布时间：
2021-11-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. Terms which have a specialized meaning or usage within a single IPC document may be defined differently within that document. Commonly used English language terms which do not change meaning when applied to electronics are not defined here.
15.[标准] Acceptability of Printed Boards

印制板的可接受性

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC A-600K

发布时间：
2020-07-09

中标分类：
-

国标分类：
-

实施时间：

摘要： The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised photographs and illustrations, revision K provides new coverage on topics such as microvia contact dimensions, plating, voiding and fill, along with updated and expanded coverage for dielectric removal (etchback, smear and wicking), plating folds, surface plating for edge connectors, SMT and BGA pads, marking, hole registration, delamination, cap plating, via fill and flexible circuits. The document synchronizes to the acceptability requirements expressed in IPC-6012D and IPC-6013C. Supersedes IPC-A-600J.
16.[标准] Requirements for Soldered Electrical and Electronic Assemblies

焊接电气和电子组件的要求

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC J-STD-001H

发布时间：
2020-09-01

中标分类：
-

国标分类：
-

实施时间：

摘要： J-STD-001 is recognized globally for its criteria on soldering processes and materials. Updated with participants from 18 countries providing input and expertise, this document brings the latest criteria along with new graphics to the industry for ease of use and comprehension. This is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. J-STD-001 is developed in synergy with IPC-A-610 and is supported by IPC-HDBK-001 for those wanting additional information and explanation on the requirements.
17.[标准] Qualification and Performance Specification for Rigid Printed Boards

刚性印制板的鉴定和性能规范

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 6012E

发布时间：
2020-02-01

中标分类：
-

国标分类：
-

实施时间：

摘要： IPC-6012E specification covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements. IPC-6012E incorporates many new and expanded requirements in areas such as back-drilled structures, alternative surface finishes, copper wrap plating, marking inks, solderability testing, plating overhang, microsection evaluation, thermal shock and performance-based testing for microvia structures. For use with IPC-6011. Supersedes IPC-6012D.
18.[标准] Requirements and Acceptance for Cable and Wire Harness Assemblies

电缆和线束组件的要求和验收

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
历史

标准号：
IPC A-620D

发布时间：
2020-01-01

中标分类：
-

国标分类：
-

实施时间：

摘要： IPC/WHMA-A-620D is the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC/WHMA-A-620D describes materials, methods, tests and acceptance criteria for producing crimped, mechanically secured and soldered interconnections and the related assembly activities associated with cable and harness assemblies.IPC/WHMA-A-620D was developed by IPC and the Wire Harness Manufacturers Association (WHMA) (An affiliate of IPC).
19.[标准] Sectional Design Standard for Rigid Organic Printed Boards

刚性有机印制板的截面设计标准

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 2222B

发布时间：
2020-10-01

中标分类：
-

国标分类：
-

实施时间：

摘要： IPC 2222B is intended to provide information on the detailed requirements for organic rigid printed board design. All aspects and details of the design requirements are addressed to the extent that they can be applied to the unique requirements of those designs that use organic rigid (reinforced) materials or organic materials in combination with inorganic materials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and mechanical components.
20.[标准] Responsible Sourcing of Minerals Data Exchange Standard

负责矿产数据交换标准的采购

发布单位：
美国-美国电子电路和电子互连行业协会(US-IPC)

标准状态：
现行

标准号：
IPC 1755A

发布时间：
2020-03-01

中标分类：
-

国标分类：
-

实施时间：

摘要： This standard establishes the requirements for exchanging data between suppliers and their customers in regard to the responsible sourcing of minerals. This standard originally addressed conflict minerals within the scope of the Dodd-Frank Act in the US and now addresses global responsible minerals sourcing.To meet the needs of a broad range of users, this standard provides flexibility in the scope of the products covered within a single declaration.This standard applies to business-to-business transactions. It is not intended to be used by the general public when making purchasing decisions. This standard is not a compliance guide.