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MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME USING APPLICATION SPECIFIC ELECTRONICS PACKAGING TECHNIQUES
MICRO POWER DISTRIBUTION BOXES AND METHODS OF MANUFACTURING SAME USING APPLICATION SPECIFIC ELECTRONICS PACKAGING TECHNIQUES
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机译:微型配电箱和使用特定应用电子封装技术制造微型配电箱的方法
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摘要
A micro power distribution box is provided comprising a device, a connector/housing and a cover. The device has a substrate, a first finger, a second finger, and an electrical component. The first finger has first, second and third portions. The second finger has first, second and third portions. A substrate is overmolded to first portions of the first and second fingers. The substrate is not overmolded to the second portions of the first and second fingers or to the third portions of the first and second fingers. Second portions of the first and second fingers extend outwardly from the substrate. Third portions of the first and second fingers are exposed through at least one opening provided through the substrate. The electrical component is mounted directly to the third portions of the first and second fingers to electrically connect the electrical component to the first and second fingers, respectively. The connector/housing is configured to receive the device therein and is configured to connect to the mating connector. The cover is configured to be secured to the connector/housing in a manner that prevents the device from being removed from the connector/housing.
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