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System and method for performing epitaxial smoothing processing on semiconductor structure
System and method for performing epitaxial smoothing processing on semiconductor structure
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机译:用于在半导体结构上执行外延平滑处理的系统和方法
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摘要
Systems and methods for processing semiconductor structures are provided. The methods generally include determining a desired removal map profile for a device layer of a semiconductor structure, determining a set of process parameters for use in an epitaxial smoothing process based on the desired removal map profile, and selectively removing material from the device layer by performing an epitaxial smoothing process on an outer surface of the device layer.
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