Reverse engineering system of PCB and method thereof

摘要

According to the present invention, 10 first for the flat surface, bottom surface, top surface, front surface, upper surface, lower surface, upper left surface, left lower surface, upper right surface and right lower surface of a printed circuit board having a guide hole and a multi-layered circuit pattern and via hole an image recording unit that takes an image; a coordinate value input unit for generating a second image by inputting three-dimensional coordinate values based on the position of the guide hole in the ten first images photographed by the image capturing unit; a magnification unit adjusting the magnification of the ten second images to which the coordinate values are input based on the coordinate values to generate a third image in which all ten second images have the same magnification; a circuit pattern separating unit that identifies and separates the circuit patterns of the printed circuit board by the number of stacks based on the ten third images whose magnification is adjusted to generate a fourth image in the plane of each layer from which the circuit patterns are separated; Via hole that identifies the position and depth of the via hole of the printed circuit board based on the 10 third images with the magnification adjusted and separates each to create a fifth image in the plane, bottom, front, back, left and right surfaces in which the via holes are separated. separator; And there is provided a printed circuit board reverse engineering system including an image conversion unit for providing drawing data by matching and overlapping the fourth image in which the circuit pattern is separated and the fifth image in which the via hole is separated.