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DUAL HEATING OR COOLING SYSTEM AND ITS USE

机译:双加热或冷却系统及其使用

摘要

The present invention relates to a radiation-emitting device (100), comprising at least one radiation source (110) configured to emit radiation of at least one wavelength towards a target (190) or towards a subject (192); at least one space or surface (140) configured to place the target (190) or the subject (192) therein or thereon; at least one means (185) configured to control the at last one radiation source's radiation emission towards the target (190) or towards the subject (192); wherein the radiation-emitting device (100) further comprises: at least one dual heating or cooling system (170) configured to heat or to cool the at least one space or surface (140) and comprising a Peltier device (171), said Peltier device (171) comprising at least two cuboids (172, 172') made of two semiconductor materials having different electron densities, said at least two cuboids (172, 172') being placed thermally in parallel to each other and electrically in series, interconnected with thermally conducting metal bridging plates (173, 173') and sandwiched between a non-conducting material reduced temperature cover plate (174) and a non-conducting material elevated temperature cover plate (174') and configured to be supplied with DC electric current via electrical connections (179); at least one first heat exchanger (175) thermally connected as a heat source to the Peltier device's (171) reduced temperature cover plate (174); at least one second heat exchanger (176) thermally connected as a heat sink to the Peltier device's (171) elevated temperature cover plate (174'); at least one fan or fan assembly (177, 178) configured to cause environmental air to flow along the at least one heat exchanger (175, 176); at least one nozzle (180) configured to pass and direct the environmental air flow having passed the at least one first and/or second heat exchanger (175, 176) and heated or cooled towards the at least one space or surface (140) configured to place the target (190) or the subject (192) therein or thereon; and at least one means (181) configured to control the DC electric current supply to the Peltier device (171). The invention also relates to a dual heating or cooling system, to the use of the dual heating or cooling system in a radiation-emitting device and a method of alternatingly heating or cooling areas or parts of a radiation-emitting device (100) before, during or after a radiation-emitting operation of said radiation-emitting device (100).
机译:辐射发射装置(100)技术领域本发明涉及一种辐射发射装置(100),包括至少一个辐射源(110),所述辐射源(110)构造成使至少一个波长的辐射朝向目标(190)或朝向主题(192)。至少一个空间或表面(140),被配置为将目标(190)或主题(192)或其上置于其中;至少一种装置(185),其被配置为控制朝向目标(190)或对象(192)的最后一个辐射源的辐射发射;其中辐射发射装置(100)还包括:至少一个双加热或冷却系统(170),其被配置为热或冷却至少一个空间或表面(140)并包括珀耳帖装置(171),所述珀尔帖包括由具有不同电子密度的两个半导体材料制成的至少两个长方体(172,172')的装置(171),所述至少两个长方体(172,172')彼此并联地和电串联地互连地放置具有导热金属桥接板(173,173')并夹在非导电材料的夹在不导电的温度盖板(174)之间,并且不导电材料升高的温度盖板(174'),并且被配置为提供直流电流通过电气连接(179);至少一个第一热交换器(175)作为热源热连接到珀耳帖装置的(171)的温度盖板(174);至少一个第二热交换器(176)作为散热器热连接到珀耳帖装置(171)升温盖板(174');至少一个风扇或风扇组件(177,178),其被配置为使环境空气沿着至少一个热交换器(175,176)流动;配置成通过并引导具有通过至少一个第一和/或第二热交换器(175,176)的环境空气流动并向所构造的至少一个空间(140)加热或冷却的环境空气流动的喷嘴(180)将目标(190)或主题(192)放置在其中或其上;并且至少一种装置(181),用于控制珀耳帖设备(171)的DC电流供应。本发明还涉及双加热或冷却系统,用于在辐射发射装置中使用双加热或冷却系统以及以前的交替加热或冷却区域或辐射发射装置(100)的方法,在所述辐射发射装置(100)的辐射发射操作期间或之后。

著录项

  • 公开/公告号EP3914346A1

    专利类型

  • 公开/公告日2021-12-01

    原文格式PDF

  • 申请/专利权人 JK-HOLDING GMBH;

    申请/专利号EP20200703154

  • 发明设计人 GERSTENMEIER JÜRGEN;

    申请日2020-01-23

  • 分类号A61N5/06;H01L35/30;H01L35/32;F25B21/02;F24F5;

  • 国家 EP

  • 入库时间 2022-08-24 22:17:01

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