The invention relates to a method for the thermal structure embossing of substrates with an embossing cylinder, the substrate (16) being guided along a heated embossing surface (3) of the embossing cylinder during embossing in order to transfer the structure of an embossing structure (4) formed in the embossing surface into the substrate ( 16) to shape. The embossing cylinder is an embossing sleeve (1) in the form of a sleeve designed as an interchangeable unit and is designed to be exchangeable for at least one other embossing sleeve, the embossing sleeve being able to be clamped onto a mandrel (13) inserted into the sleeve for assembly in an embossing system, and the embossing surface ( 3) of the embossing sleeve (3) is heated via the mandrel (13).
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