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METHOD OF MANUFACTURING A HEMT DEVICE WITH REDUCED GATE LEAKAGE CURRENT, AND HEMT DEVICE

机译:用闸门漏电流和HEMT装置制造HEMT装置的方法

摘要

An HEMT device of a normally-on type, comprising a heterostructure; a dielectric layer extending over the heterostructure; and a gate electrode extending right through the dielectric layer. The gate electrode is a stack, which includes: a protection layer, which is made of a metal nitride with stuffed grain boundaries and extends over the heterostructure, and a first metal layer, which extends over the protection layer and is completely separated from the heterostructure by said protection layer.
机译:常开型的HEMT装置,包括异质结构; 延伸在异质结构上的介电层; 和栅电极通过介电层延伸。 栅电极是堆叠,其包括:保护层,其由具有填充晶界的金属氮化物制成,并且在异质结构上延伸,并且第一金属层延伸在保护层上并与异质结构完全分离 由所述保护层。

著录项

  • 公开/公告号US2021313446A1

    专利类型

  • 公开/公告日2021-10-07

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS S.R.L.;

    申请/专利号US202117350916

  • 发明设计人 FERDINANDO IUCOLANO;PAOLO BADALÁ;

    申请日2021-06-17

  • 分类号H01L29/66;H01L21/285;H01L29/20;H01L29/205;H01L29/47;H01L29/778;

  • 国家 US

  • 入库时间 2024-06-14 22:11:19

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