ELECTRONIC DEVICE HOUSINGS WITH CHAMFERED EDGES

摘要

In one example, a method (100) for manufacturing an electronic device housing may include forming an oxide layer on a surface of a metal substrate (102). Further, an edge region of the metal substrate may be chamfered to form an exposed surface portion of the metal substrate (104). The exposed surface portion of the metal substrate may be electrocleaned (106). Upon electrocleaning the exposed surface portion, a transparent protective passivation layer may be formed on the exposed surface portion (108). Furthermore, an electrophoretic deposition layer may be formed on the transparent protective passivation layer (110).