A cooling sub-assembly for cooling a heat dissipating electronic device. The sub-assembly may comprise a vapor chamber (7), a peltier element (9) and a coldplate (10) placed on top of each other forming a stack such that the peltier element is sandwiched between the vapor chamber (7) and the coldplate (10). The vapor (7) chamber has a head (7a) facing the peltier element, a foot (7b) for facing the heat (7a) dissipating electronic device, and a wall (7c) extending between the foot(7b) and the head (7a). The area of the head (7a) is larger than the area of the foot (7b).
展开▼
