Method of attaching semiconductor chip to support substrate, semiconductor chip polishing method, and method of attaching wafer and supporting substrate

摘要

Problem: the semiconductor chip or wafer is bonded in parallel to the support substrate.A support substrate 20 made of a first permanent magnet and a semiconductor chip 10 are bonded with wax 31The first step of forming the first paste 102 andA second step of preparing an adsorbent 40 having a first paste 102 and a second permanent magnet 25 adsorbed thereonA third step SP4 for heating the adsorbent 40 over the melting point of the wax 31 andThe third step SP5 cooling the adsorbent 40 heated atThe fourth permanent magnet 25 is separated from the adsorbent 40 cooled atThe fifth step SP6 is provided with a fifth step SP6 for forming the second paste 100 to which the semiconductor chip 10 and the support substrate 20 are adhered.Diagram