A resin composition, a photosensitive resin composition, a cured film, the manufacturing method of a cured film, the manufacturing method of a pattern cured film, and a pattern cured film

摘要

The polysiloxane composition containing the structural unit represented by Formula (1), the polysiloxane compound containing the structural unit of at least one of Formula (2) and Formula (3), and a solvent. [(R ^x ) _b R ¹_m SiO _n/2 ] (1) [(R ^y ) _c R ²_p SiO _q/2 ] (2) [SiO _4/2 ] (3) Here, R ^x is a monovalent group represented by the formula (1a) (X is a hydrogen atom or an acid labile group, a is an integer of 1 to 5, and the broken line indicates a bond), R ^y is an epoxy group, oxetane It is a C1-C30 monovalent organic group containing any of a group, an acryloyl group, and a methacryloyl group.