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ADHESIVE TAPE CUTTING DEVICE

机译:胶带切割装置

摘要

An adhesive tape cutting device (10). The adhesive tape cutting device (10) comprises: an adhesive tape conveying mechanism (100), comprising a rack (110), a material cylinder (120), and an adhesive tape conveying assembly (130), wherein the material cylinder (120) and the adhesive tape conveying assembly (130) are arranged on the rack (110), and the rack (110) is configured to bear an adhesive tape (201) from the material cylinder (120); a first winding mechanism (200), comprising a first winding drum (210) and a cutting assembly (220) arranged on the rack (110), wherein the cutting assembly (220) is configured to cut a protective layer (21) and an adhesive layer (22) on a cutting end (25), and the first winding drum (210) is configured to wind the cut protective layer (21) and the adhesive layer (22); and a second winding mechanism (300), comprising a second winding drum (310) arranged on the rack (110) and configured to wind the remaining uncut protective layer (21). The adhesive tape conveying assembly (130) outputs a base layer (23) and the remaining uncut adhesive layer (22) from the rack (110).
机译:胶带切割装置(10)。胶带切割装置(10)包括:粘合带传送机构(100),包括齿条(110),材料缸(120)和粘合带传送组件(130),其中所述材料缸(120)并且胶带输送组件(130)布置在齿条(110)上,并且齿条(110)构造成从材料缸(120)承载粘合带(201);第一绕组机构(200),包括设置在齿条(110)上的第一绕组鼓(210)和切割组件(220),其中切割组件(220)构造成切割保护层(21)和一个在切割端(25)上的粘合剂层(22),第一绕组鼓(210)被配置为缠绕切割保护层(21)和粘合剂层(22);和第二绕组机构(300),其包括布置在齿条(110)上的第二绕组鼓(310)并且被配置为缠绕剩余的未接受保护层(21)。粘合带传送组件(130)从齿条(110)输出基层(23)和剩余的未染色层(22)。

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