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Polishing apparatus and polishing method

机译:抛光设备和抛光方法

摘要

Problem to be solved: to improve the accuracy of polishing endpoint detection in the method in which the top ring is held at the end of the swing arm.The polishing apparatus for polishing between the polishing pad 10 and the semiconductor wafer 16 disposed opposite to the polishing pad 10 has a polishing table 30A for holding the polishing pad 10 and a top ring 31a for holding the semiconductor wafer 16.The swing shaft motor 14 oscillates the swinging arm 110 for holding the top ring 31a.The arm torque detecting section 26 detects the arm torque applied to the swinging arm 110.The end point detecting section 28 detects the polishing endpoint indicating the end of Polishing Based on the detected arm torque.Diagram
机译:要解决的问题:为了提高抛光端点检测的准确性,其中顶环保持在摆臂的末端。用于在抛光焊盘10和与抛光垫10相对设置的抛光焊盘10和半导体晶片16之间的抛光设备具有抛光台30A,用于保持抛光垫10和用于保持半导体晶片16的顶环31a。摆动电动机14振动用于保持顶环31a的摆动臂110.臂转矩检测部分26检测施加到摆臂110的臂扭矩。终点检测部分28检测抛光端点,指示基于检测到的臂扭矩的抛光结束。图表

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