首页>
外国专利>
METHOD FOR BONDING SUBSTRATES USING AREA-SELCTIVE DEPOSITION
METHOD FOR BONDING SUBSTRATES USING AREA-SELCTIVE DEPOSITION
展开▼
机译:使用面积选择性沉积粘合基材的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to a bonding method between substrates such as semiconductors using a selective deposition method, and more particularly, to a bonding method between substrates that minimizes the occurrence of mechanical and electrical defects between bonding surfaces even at low temperatures by using the selective deposition method. .
展开▼