Interconnection structure of integrated circuits

摘要

Interconnection structure of integrated circuitsThe specification relates to a process including the following steps: providing an integrated circuit (1), including: a first stack (5), an integrated circuit (1), and,A second (7) and a third (9) insulating layer;A contact (11) passing through the first layer (5);And a member (13) including an electrical contact area (15) in the second layer (7);The opening (35) is etched in the third layer (9),Flatness (15) of the contact area;A fourth insulating layer (37) is applied on the opening (35);Etching another opening (43) to the contact area (15) through an opening (35) in the third insulating layer (9);Another opening is filled with metal (45) to form a metal horizontal plane.Abstract figure: Figure 7