Flux and solder paste

摘要

Problem to be solved: to suppress the generation of voids and to suppress the generation of voids, and to provide a solder paste using flux and flux which improves the wettability of solder.Flux contains rosin and tris (2-carboxyethyl) isocyanurate and solvents, containing 0.1% by weight or more to 15% by weight of tris (2-carboxyethyl) isocyanate.The solder paste contains flux and metal powder, and the flux contains rosin and tris (2-carboxyethyl) isocyanurate and solvents and contains tris (2-carboxyethyl) isocyanate over 0.1 mass% or more to 15 mass% or less.No choice