Polyimide film and copper clad laminate

摘要

Problem to be solved: to provide a polyimide film capable of reducing dimensional change during high-temperature processing and a copper clad laminate using the polyimide film.A long polyimide film having a thermoplastic polyimide layer at least one of the non thermoplastic polyimide layers;The width of the film in the width direction (TD direction) is within the range of 490 mm to(I) within a range of 10 to 30 ppm / K(II) within the range of the glass transition temperature of the thermoplastic polyimide at temperatures of 200 to(III) within the range of in-plane retardation (RO) of 5 nm to 50 nm;(IV) variation of RO in the width direction (TD direction) Δ Ro satisfies 10 nm or less.No selection