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Electrolytic polishing apparatus and electrolytic polishing method

机译:电解抛光装置和电解抛光方法

摘要

Problem to be solved: to provide an electrolytic polishing apparatus capable of uniformly polishing an object to be polished at a hole even if an electropolishing is performed by attaching a seal having holes in a polishing point.Solution: the torch 2 in which the electrode 23 is placed inside and electrolyte electrolyte SL is put into placeAn energizing device 1 for energizing between the electrode 23 and the polishing object OB is provided.The electrolyte SL is brought into contact with the object OB in the tip of the torchBy energization by the power supply 1In an electropolishing apparatus for electropolishing the surface of an abrasive obA moving means for reciprocating the electrode 23 in the longitudinal direction of the torch 2Electric current apparatus 1 isThe distance between the tip electrode 24 and the tip of the torch 2 varies by the moving meansOnly when the predetermined distance is less than the predetermined distance is conducted.Diagram
机译:要解决的问题:提供一种电解抛光装置,其能够均匀地抛光在孔处抛光的物体,即使通过在抛光点中的孔附接到具有孔的密封件来进行电抛光。解决方案:将电极23放置在其中电极23和电解质电解质S1的焊炬2被放入介绍通电装置1中,以便在电极23和抛光对象之间进行通电。电解质SL与对象接触电源1在电源1中的电力抛光装置中的电力抛光装置,用于在焊炬2电流装置1的纵向方向上往复运动的磨料OBA移动装置的表面,是尖端电极24和尖端之间的距离当传导预定距离小于预定距离时,炬2的移动均匀变化.diagram

著录项

  • 公开/公告号JP2021088729A

    专利类型

  • 公开/公告日2021-06-10

    原文格式PDF

  • 申请/专利权人 パルステック工業株式会社;

    申请/专利号JP20190217748

  • 发明设计人 鈴木 哲也;

    申请日2019-12-02

  • 分类号C25F7;C25F3/16;B24B37;B23H3/02;B23H3/10;B23H9;

  • 国家 JP

  • 入库时间 2022-08-24 19:09:24

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