Copper alloy for electronic material, electronic component and method for producing copper alloy for electronic material

摘要

Problem to be solved: to provide a highly reliable copper alloy for electronic materials, which has a strength of 0.2%, a conductivity, and a bending performance and a superior machinability.Copper alloys for use in electronic materials0.5 to 3.0 mass% CoContains 0.0 to 2.0 mass% NiThe mass of Si (Ni + CO) is contained in the mass ratio ofThe remainder consists of Cu and inevitable impurities.Rolling directionRolling direction and ° DirectionRolling directions and ° The machining hardening index in each direction is N0.N45N90,N45 is 0.010 to 0.100.And Δ N = N0 + n90-2 × Defined in N45 Δ The value of n is between 0.050 andThe 0.2% strength of the rolling direction is over 600 MPa.The conductivity in the rolling direction is over 50% IACS.Diagram