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Sputtering target material, manufacturing method of sputtering target material, and manufacturing method of laminated substrate with piezoelectric thin film

机译:溅射靶材料,溅射靶材料的制造方法,以及压电薄膜层压基板的制造方法

摘要

Problem to be solved: to provide a sputtering target material comprising a sintered body represented by a composition formula (K1 xnax) NbO3 (0 < x < 1).A sputtering target material comprising a sintered body represented by a compositional formula (K1 xnax) NbO3 (0 < x < 1) and containing a metal element selected from the group consisting of Cu and Mn at a concentration of 0.2 at% or more than 0.6 at%.Diagram
机译:要解决的问题:提供一种溅射靶材料,其包含由组合式式(K1 XNAX)NBO3(0

著录项

  • 公开/公告号JP2021088773A

    专利类型

  • 公开/公告日2021-06-10

    原文格式PDF

  • 申请/专利权人 住友化学株式会社;

    申请/专利号JP20210019422

  • 发明设计人 柴田 憲治;渡辺 和俊;堀切 文正;

    申请日2021-02-10

  • 分类号C23C14/34;C01G33;C04B35/495;H01L41/187;H01L41/316;H01L41/332;H01L41/09;H01L41/113;H03H9/25;

  • 国家 JP

  • 入库时间 2022-08-24 19:09:23

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