Surface treated copper foil, copper clad laminate and printed wiring board

摘要

A surface treated copper foil 1 having copper foil 2 and first surface treatment layer 3 formed on one surface of copper foil 2. The surface treatment layer 3 of the surface treated copper foil 1 has a Ni deposition amount of 20 to 200 μ G / DM 2, Zn deposition amount μ G / DM2. The copper clad laminate plate 10 comprises a surface treated copper foil 1 and an insulating substrate 11 bonded to the first surface treatment layer 3 of the surface treated copper foil 1.