首页> 外国专利> Substrate processing chamber having improved process volume sealing

Substrate processing chamber having improved process volume sealing

机译:基板处理室具有改进的工艺体积密封

摘要

Embodiments of process chambers are provided herein. In some embodiments, a process chamber includes: a chamber wall defining an inner volume within the process chamber; a substrate support disposed in the inner volume having a support surface to support a substrate, wherein the inner volume includes a processing volume disposed above the support surface and a non-processing volume disposed at least partially below the support surface; a gas supply plenum fluidly coupled to the processing volume via a gas supply channel disposed above the support surface; a pumping plenum fluidly coupled to the processing volume via an exhaust channel disposed above the support surface; and a sealing apparatus configured to fluidly isolate the processing volume from the non-processing volume when the substrate support is in a processing position, wherein the processing volume and the non-processing volume are fluidly coupled when the substrate support is in a non-processing position.
机译:本文提供了处理室的实施例。在一些实施例中,处理室包括:腔室壁,限定在处理室内的内部容积;设置在具有支撑表面以支撑基板的内部容积中的基板支撑件,其中内部容积包括设置在支撑表面上方的处理容积和至少部分地设置在支撑表面下方的非处理体积;通过设置在支撑表面上方的气体供应通道流体耦合到处理容积的气体供应增压室;通过设置在支撑表面上方的排气通道流体耦合到处理容积的泵送增压室;并且一种密封装置,该密封装置被配置为当基板支撑处于处理位置时从非处理体积流体地将处理容积流体隔离,其中当基板支撑处于非处理时,处理容积和非处理体积流体耦合位置。

著录项

  • 公开/公告号US10998172B2

    专利类型

  • 公开/公告日2021-05-04

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号US201816132962

  • 申请日2018-09-17

  • 分类号H01J37/32;C23C14/54;C23C14/56;C23C14/35;C23C14/50;C23C14/34;

  • 国家 US

  • 入库时间 2022-08-24 18:31:39

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