HIGH PERFORMANCE AND HIGH RELIABILITY THERMAL GROUND PLANE

摘要

The present invention discloses a high performance and high reliability plate-shaped heat dissipating device. A high-performance and high-reliability plate-shaped heat dissipating element according to an embodiment of the present invention includes a case including an upper base plate and a lower base plate; A wick formed on one side of the upper base plate or the lower base plate, or formed on both the upper base plate and the lower base plate; And a working fluid flowing inside the wick and in which nanoparticles are dispersed, wherein the wick moves the working fluid by capillary force.