PROCEDURES FOR THE formation of a SPECIAL AREA

摘要

This disclosure concerns an integrated chip in some versions. The integrated chip contains several lower interconnect layers arranged within a dielectric structure over a substrate. The integrated chip also contains a storage device which has a data storage structure,which is placed between a lower electrode and an upper electrode. The lower electrode is electrically coupled with several lower interconnect layers. A lateral resistance holder continuously extends from an outer side wall of the data storage structure to an outer side wall of the lower electrode.