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Method of manufacture of cadmium telluride with a high resistance and a semi - conductor or a photosensitive device incorporating the cadmium telluride thus manufactured

机译:具有高电阻的碲化镉的制造方法以及包含这样制造的碲化镉的半导体或光敏器件

摘要

910,449. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. May 8, 1959 [May 13, 1958], No. 15884/59. Drawings to Specification. Class 37. In a method of manufacturing a semi-conductor device having a body of CdTe which is converted, at least in part, into high ohmic CdTe, the body or the relevant part thereof is provided with a predominant concentration of donor impurities up to a content of at least 10SP15/SP/CmSP3/SP and heated to a temperature between 500‹ C. and the maximum melting temperature of CdTe in a partial Cd pressure which is lower than the Cd pressure of stoichiometric CdTe at the treatment temperature but higher than the Cd pressure of solid CdTe which is in equilibrium with its liquid at such temperature, for a time sufficient to bring the body or the part to a specific resistance of at least 10SP5/SP ohm-cms., preferably higher than 10SP6/SP ohmcms. The explanation is advanced that, due to the predominance of donor impurities, a plurality of deep-lying energy levels are formed around the centre of the prohibited energy zone, about equal in number to the incorporated donor levels, and that, during cooling after the tempering treatment, the CdTe becomes high ohmic due to the high activation energy of these deep-lying levels. Suitable donor impurities mentioned are In, Ga, Cl, I, Br; preferably, non-volatile impurities are introduced into the melt, while volatile impurities are diffused into the solid CdTe. The CdTe body may be poly- or mono-crystalline or in the pulverulent state, and, when partial conversion is required, a body uniformly doped may be tempered for a time so short that only a superficial conversion occurs, or the donors may be provided locally; alternatively, the whole body may be converted, the portions not required to be high ohmic being subsequently given a desired conductivity by conventional techniques. Preferred donor concentrations are 10SP16/SP to 10SP18/SP/CmSP8/SP, especially 101SP7/SP to 5 X 10SP17/SP/CmSP3/SP. Temperatures of from 700‹ to 1000‹ C. are preferred. In one example, a number of monocrystalline rods obtained from CdTe uniformly doped with In to concentrations of 1.3 x 10SP17/SP/CmSP3/SP, 2 Î 10SP17/SP/ CmSP3/SP and 5 x 10SP17/SP/CmSP3/SP are converted to specific resistances of 10SP7/SP to 10SP8/SP ohm-cms. by being heated in an atmosphere of Cd and Te, the relative pressures of which are adjustable. A temperature-pressure diagram (not reproduced) shows the partial Cd pressure as a function of the treatment temperature, and a table in the Specification shows the treatment duration; the latter is shortened to produce high ohmic superficial layers. In other examples, Ga replaces In as the donor impurity; intrinsic CdTe is heated in an atmosphere containing a volatile donor (Br) and a partial Cd pressure simultaneously; and an In-doped rod is pulverized, pressed into a pill, and sintered at 1000‹ C., in a flow of N 2 which has been led over heated CdTe. Applications mentioned are crystal diodes, transistors and particularly photo-sensitive devices, e.g. photo-diodes, infrared telescopes, image intensifiers, camera tubes, X-ray dosimeters &c.
机译:910,449。半导体器件。飞利浦电气工业有限公司。1959年5月8日[1958年5月13日],第15884/59号。图纸按规格。第37类。在制造具有至少部分转化成高欧姆CdTe的CdTe主体的半导体器件的方法中,该主体或主体的相关部分的主要供体杂质浓度最高为含量至少为10 15 / Cm 3 ,并在低于Cd的分压下加热至500℃至CdTe的最高熔化温度之间的温度化学计量的CdTe在处理温度下的Cd压力,但高于在该温度下与其液体处于平衡状态的固态CdTe的Cd压力,持续足以使主体或零件达到至少10 < SP> 5 ohm-cms,最好高于10 6 ohm-cms。进一步的解释是,由于施主杂质占主导地位,在禁能区的中心周围形成了多个深处的能级,其数量大约等于掺入的施主能级,并且在冷却之后回火处理后,由于这些深能级的高活化能,CdTe变为高欧姆。提到的合适的施主杂质是In,Ga,Cl,I,Br; Al,Al,Al,Al和N。优选地,将非挥发性杂质引入到熔体中,同时将挥发性杂质扩散到固体CdTe中。 CdTe体可以是多晶或单晶的,也可以是粉状的,当需要部分转化时,均匀掺杂的体可以回火一段时间,以至于仅发生表面转化,或者可以提供施主本地可替代地,可以转换整个身体,不需要高欧姆的部分随后通过常规技术被赋予期望的导电性。优选的供体浓度为10 16 至10 18 / Cm 8 ,尤其是101 7 至5 X 10 17 / Cm 3 。 700℃至1000℃的温度是优选的。在一个示例中,从CdTe获得的一些单晶棒均匀地掺杂了In,浓度为1.3 x 10 17 / Cm 3 ,2Î10 17 / Cm 3 和5 x 10 17 / Cm 3 转换为电阻率10 7 10 8 ohm-cms。通过在相对压力可调的Cd和Te气氛中加热。温度-压力图(未复制)显示了Cd分压随处理温度的变化,规格表中显示了处理时间;后者被缩短以产生高欧姆表层。在其他实例中,Ga替代In作为施主杂质;本征CdTe在同时包含挥发性供体(Br)和Cd分压的气氛中加热;然后将In-掺杂的棒粉碎,压成药丸,并在N 2流中于1000℃烧结,该N 2流经加热的CdTe引导。提到的应用是晶体二极管,晶体管,尤其是光敏器件,例如液晶显示器。光电二极管,红外望远镜,图像增强器,摄像管,X射线剂量计等。

著录项

  • 公开/公告号FR1224458A

    专利类型

  • 公开/公告日1960-06-24

    原文格式PDF

  • 申请/专利权人 PHILIPS NV;N. V. PHILIPS GLOEILAMPENFABRIEKEN;

    申请/专利号FR19590794577

  • 发明设计人

    申请日1959-05-13

  • 分类号C30B1/02;C30B13;C30B33;H01L21/477;

  • 国家 FR

  • 入库时间 2022-08-23 19:10:31

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