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Semiconductor component with a volume effect for the generation of high frequency wechselstroeme

机译:具有体积效应的半导体元件,用于产生高频韦氏弹性体

摘要

1,217,522. Semi-conductor oscillators. INTERNATIONAL BUSINESS MACHINES CORP. 4 April, 1968 [14 Aug., 1967], No. 16232/68. Heading H3T. [Also in Division H1] An oscillator uses a body of a semiconductor material which at least in certain crystallographic directions has the drift velocity applied field relationship shown. In the embodiment the body is of germanium doped with antimony or bismuth and is provided with two non- injecting contacts such that the field is applied in a (100) direction. The contacts are of soldered or alloy type and include diffused or alloyed terminal regions of the same conductivity type as the centre of the body. To obtain oscillations the voltage applied to the two contacts must exceed a threshold voltage v 1 ; above this threshold oscillations categorized as Type I occur until a voltage v 2 is reached when they cease. Type II oscillations occur in a higher voltage range v 3 upwards, the upper limit of this range being made less than the voltage which produces avalanche breakdown of the body. For many devices v 2 = V 3 . Within the lower part of the range v 1 -v 2 the frequency increases slightly with voltage; at a certain point it jumps by a factor of about 2 and then again, in the upper part of the range, increases slightly with voltage. With some of the devices the v 1 -v 2 range is split into three parts: high v; low v; high v. The Type IT oscillations, which occur at roughly a tenth of the frequency of the Type I oscillations, are believed to arise from a minority carrier mechanism involving periodic local avalanching (resulting from impact ionization) but not total breakdown. Type II operation is favoured by using lower temperatures. At very low temperatures and at voltage above v 1 a crystal length-dependent Type III oscillation may occur which involves a domain propagation mode which, like the other modes, is not, however, thought to involve an inter-valley transfer mechanism. The preferred geometry for Type I operation is described by Fig. 11A (not shown) and that for Type II operation by Fig. 11B (not shown). The shape of Fig. 11C (not shown) allows Type I oscillation to take place at a lower v 1 than for an otherwise similar uniform body but leads to a lower amplitude of oscillation and polarity dependant operation. The oscillators may have resistive or reactive loads; the latter may be tuned and though shown in Fig. 1A as comprising discrete components may instead be a cavity or waveguide completely or partially containing the semiconductor device to which it is electromagnetically coupled. Tests show that the oscillations are pressure-dependant, through this fact is not made use of in operation of the embodiments.
机译:1,217,522。半导体振荡器。国际商业机器公司,1968年4月4日[1967年8月14日],第16232/68号。标题H3T。 [也在H1部分中]振荡器使用半导体材料的主体,该半导体材料的主体至少在某些晶体学方向上具有所示的漂移速度施加场关系。在该实施例中,主体是掺杂有锑或铋的锗,并且设有两个非注入触点,使得沿(100)方向施加场。触点是焊接或合金类型的,并包括与主体中心具有相同导电类型的扩散或合金化端子区域。为了获得振荡,施加在两个触点上的电压必须超过阈值电压v 1。超过此阈值(分类为I型)的振荡会发生,直到停止时达到电压v 2为止。 II型振荡在较高的电压范围v 3向上发生,使该范围的上限小于产生身体雪崩击穿的电压。对于许多设备,v 2 = V 3。在范围v 1 -v 2的下部,频率随电压略有增加;在某个点上,它跳了大约2倍,然后在范围的上部再次随电压而稍微增加。对于某些设备,v 1 -v 2范围分为三个部分:高v;低v高v。发生在I型振荡频率的十分之一左右的IT型振荡被认为是由少数载流子机制引起的,该机制涉及周期性的局部雪崩(由于碰撞电离而产生),而不是全部击穿。使用较低温度有利于II型操作。在非常低的温度和高于v 1的电压下,可能会发生与晶体长度相关的III型振荡,该振荡涉及畴传播模式,但是与其他模式一样,该模式不被认为涉及谷间转移机制。图11A(未示出)描述了用于I型操作的优选几何形状,图11B(未示出)描述了用于II型操作的优选几何形状。图11C的形状(未示出)允许I型振荡发生在比其他类似的均匀物体更低的v 1处,但是导致更低的振荡幅度和取决于极性的操作。振荡器可能具有电阻性或电抗性负载。后者可以被调谐,并且尽管在图1A中显示为包括分立的组件,但是可以替代地是完全或部分地包含与其电磁耦合的半导体器件的腔或波导。测试表明,振荡是压力相关的,因此在实施例的操作中没有利用这一事实。

著录项

  • 公开/公告号DE1766416B2

    专利类型

  • 公开/公告日1973-01-25

    原文格式PDF

  • 申请/专利权人

    申请/专利号DE19681766416

  • 发明设计人

    申请日1968-05-18

  • 分类号H03B7/14;

  • 国家 DE

  • 入库时间 2022-08-23 07:11:12

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