Process for the preparation of a aperfeicoado eletrodeposito ferro alloy composition includes an aqueous solution and aperfeicoada of galvanizacao

摘要

1461246 Electro-depositing iron-nickel/cobalt alloys M & T CHEMICALS Inc 10 Sept 1975 [16 Sept 1974] 37294/75 Heading C7B An alloy of Fe-Ni, Fe-Co or Fe-Ni-Co is electro-deposited on a substrate, e.g. of Ni, Co, Ni-Co, Cu, Sn, brass, bronze, steel or Zn-base die casting, which may be metal plated e.g. with Cu, from an aqueous acidic plating solution containing at least one ferrous and at least one Ni and/or Co compounds, e.g. sulphate or sulphamate with or without chloride, and (a) erythorbic and/or (iso)ascorbic acid and (b) an aryl and/or aralkyl (e.g. benzene, toluene, xylene or naphthalene) sulphinate. The solution may also include boric acid and one or more additives chosen from (i) primary brighteners, e.g. diethoxylated or dipropoxylated 2 butyne-1, 4-diol, other butyne acetylenics, N-1, 2-dichloropropenyl pyridinium Cl, 2, 4, 6-trimethyl N-propargyl pyridinium Br, N-allyl quinolinium (or quinaldinium) Br, propargyl alcohol, thiodiproprionitrile, thiourea, phenosafranin or fuchsin; (ii) secondary brighteners such as aromatic sulphonates, sulphonamides, sulphonimides or sulphinates, e.g. saccharin, trisodium 1,3,6-naphthalene trisulphonate, sodium benzene monosulphonate or -sulphinate or dibenzene sulphonimide; (iii) secondary auxiliary brighteners such as aliphatic or aromatic-aliphatic olefinically or acetylenically unsaturated sulphonates, sulphonamides or sulphonimides. e.g. Na allyl sulphonate, Na-3-chloro-2-butene-1- sulphonate, Na #-styrene sulphonate, Na propargyl sulphonate, monoallyl sulphamide, diallyl sulphamide or allyl sulphonamide; (iv) anti-pitting agents such as organic (preferably anionic) surfactants, e.g. Na lacryl (ether) sulphate, Na dialkylsulphosuccinate or Na 2-ethylhexyl sulphate. Additive (iii) may include ions of Zn, Cd or Se. The anodes may comprise chunks of the plating metals (Fe with Ni and/or Co) in Ti baskets, or alloys of these metals, preferably covered with plastic bags. The plating solution may be agitated by pumping, air and/or moving cathode rod.