首页> 外国专利> Printed circuit board dip soldering - simplified by fixing push-through printed circuit board in large recess of carrier board

Printed circuit board dip soldering - simplified by fixing push-through printed circuit board in large recess of carrier board

机译:印刷电路板浸焊-通过将压入式印刷电路板固定在载板的大凹槽中而简化

摘要

A system for dip soldering two printed circuit boards (PCBs) has one PCB designed as a carrier and one as a push-through PCB. The recess in the carrier PCB is large enough to accept the fully assembled push-through PCB. One soldering cycle is thus adequate to complete the soldering of all conductor tracks and of all modules.
机译:一种用于浸焊两个印刷电路板(PCB)的系统,其中一个PCB设计为载体,一个PCB设计为推入式PCB。载体PCB中的凹槽足够大,可以容纳完全组装的直插式PCB。因此,一个焊接周期足以完成所有导线和所有模块的焊接。

著录项

  • 公开/公告号DE2752665A1

    专利类型

  • 公开/公告日1979-05-31

    原文格式PDF

  • 申请/专利权人 PHILIPS PATENTVERWALTUNG GMBH;

    申请/专利号DE19772752665

  • 发明设计人 FRANZGERHARD;

    申请日1977-11-25

  • 分类号H05K3/34;

  • 国家 DE

  • 入库时间 2022-08-22 19:47:54

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