Pretreating light metals prior to soldering - esp. aluminium, titanium, beryllium, magnesium (alloys), by coating substrate with palladium alloy contg. cobalt and/or iron

摘要

The surface of the substrate to be exposed to solder is pref. coated with a Pd alloy (I) contg. by wt. 20-70% Co and/or Fe, and pref, also 3-20% Cr and/or Mn and/or Ti. Coating (I) is pref. applied via vacuum vapour deposition or by sputtering; and the substrate is pref. first cleaned by sputter etching. Prior to applying (I), the substrate is pref. first coated with a thin layer of Cr, Ti, Mg or Al to aid the adhesion of (I). The light metals form an oxide skin. The invention replaces the oxide skin so these metals can easily be soft-soldered via typical fluxes and without using toxic materials.