Surface treatment of ceramic electronic components - esp. chip capacitors, which are subjected to several rumbling operations to polish their surfaces prior to metallisation

摘要

The components are e.g. multilayer ceramic capacitors contg. sets of electrodes and baked at high temp. to sinter the ceramic. After sintering, the capacitors are (a) rumbled in a mixt. of alumina grains; dielectric ceramic grains, and grains of a glass flux; (b) rumbled in alumina grains; (c) baked at below the sintering temp. of the ceramic, and then metallised to provide two or more electrode connections. The treatment (abc) is pref. carried out two or three times, and is pref. preceded by wet or dry rumbling rounding the corners of the capacitor. Rumbling (a) is pref. for 5-20 minutes; (b) for 1-5 minutes; and baking (c) is pref. at 700-900 deg.C for 5-20 minutes. The removal of microfissures or porosity on the surface of ceramics esp. on chip capacitors for hybrid integrated circuits.