首页> 外国专利> process for the manufacture of halfgeleiderinrichtingen involving the breakdown of a plate to obtain individual semiconductor devices semiconductor boules with preservation of the picts in relation to each other in the plate after the semiconductor boules subdivide meeting be held on a common dragerlichaam.

process for the manufacture of halfgeleiderinrichtingen involving the breakdown of a plate to obtain individual semiconductor devices semiconductor boules with preservation of the picts in relation to each other in the plate after the semiconductor boules subdivide meeting be held on a common dragerlichaam.

机译:用于制造半球形填料的方法,该方法包括将板分解以得到单个半导体器件,并且在将半导体块细分会议在共同的德拉格哈姆峰上举行之后,在板中保留相对于彼此的皮点。

摘要

机译:

著录项

  • 公开/公告号NL172903C

    专利类型

  • 公开/公告日1983-11-01

    原文格式PDF

  • 申请/专利号NL19700011336

  • 发明设计人

    申请日1970-07-31

  • 分类号H01L21/68;H01L21/58;H01L21/60;H01L23/14;

  • 国家 NL

  • 入库时间 2022-08-22 11:06:32

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