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A process for the electrodeposition of deposits smooth, bright and ductile copper.
A process for the electrodeposition of deposits smooth, bright and ductile copper.
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机译:电沉积沉积的光滑,光亮和易延展的铜的工艺。
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摘要
A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating bath having dissolved therein a brightening amount of a compound comprising a substituted phthalocyanine radical. In accordance with a preferred embodiment, the composition and method further includes in the copper plating bath secondary brightening agents including aliphatic polysulfides and/or organic sulfides and/or polyethers, as well as other known additives for acid copper plating baths.
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