首页> 外国专利> PROCESS OF ELECTROPLATING AN ARTICIE BY DEPOSITION OF THICK CHROMIUM FILMS FROM AQUEOUS SOLUTIONS OF CHROMIUM(III)-THIOCYANATE COMPLEXES

PROCESS OF ELECTROPLATING AN ARTICIE BY DEPOSITION OF THICK CHROMIUM FILMS FROM AQUEOUS SOLUTIONS OF CHROMIUM(III)-THIOCYANATE COMPLEXES

机译:通过沉积铬(III)-硫氰酸盐络合物水溶液中的厚铬膜进行电镀的工艺

摘要

A process of electroplating an article with a layer of chromium exceeding five microns in thickness comprising the step of electroplating the article with an initial layer of chromium from an equilibrated aqueous solutions of chromium (III)-thiocyanate complexes of chromium concentration less than ----- initial layer being thin in comparison with the ----- to be plated, and plating the major proportion ----- containing thickness in one or more steps from an ----- aqueous solution of chromium (III)-thiocyanate complexes of chromium concentration greater than 0.03.
机译:用厚度超过五微米的铬层电镀制品的方法,包括从铬浓度小于---的平衡的铬(III)-硫氰酸盐络合物的水溶液中用初始的铬层电镀制品的步骤。 -与要电镀的-----相比,初始层薄,并且从-----铬(III)的水溶液中一步或多步电镀主要部分-----包含厚度-硫氰酸盐络合物的铬浓度大于0.03。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号