METHOD FOR SEMICONDUCTOR CHIPS DOWN FOR WELDING IN SURFACE OF A NON-PRECIOUS METALS.

摘要

After the support of not-noble metal has suitably been heated and before and during the application of a tablet of soldering material destined to receive the semiconductor chip, the soldering area is engaged by a reducing gas flame (for example, 20% hydrogen and 80% nitrogen at a temperature lower than 570 DEG C.), which eliminates any oxidation products. The soldering is thus of very good quality without using the normal plating of noble metal.