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Integrated three-dimensional localized epitaxial growth of Si with localized overgrowth of GaAs

机译:Si的三维局部外延生长与GaAs的局部过度生长

摘要

Localized epitaxial growth of GaAs from a silicon monocrystalline substrate to provide a three-dimensional Si-GaAs structure and method. The silicon has an insulating layer deposited thereover and a window is opened through the layer to expose a small area of the underlying silicon from which silicon is epitaxially grown until the window is nearly full whereupon a thin buffer layer such as germanium is epitaxially grown over the epi-silicon to fill the window. Al.sub.x Ga. sub.1-x As (where x. gtoreq.0) is then locally epitaxially grown from the buffer layer and it grows laterally as well as vertically to cover the surrounding insulating layer surface and provide a site for high frequency electronics.
机译:从硅单晶衬底局部外延生长GaAs以提供三维Si-GaAs结构和方法。硅具有沉积在其上的绝缘层,并且通过该层打开窗口以暴露出下面的硅的小区域,从该区域外延生长硅,直到窗口几乎填满为止,随后在该硅上外延生长了诸如锗的薄缓冲层。 Epi-硅填充窗口。然后从缓冲层局部外延生长Al x Ga 1-x As(其中x gtoreq.0),并横向和垂直生长以覆盖周围的绝缘层表面并为高频电子产品。

著录项

  • 公开/公告号US4551394A

    专利类型

  • 公开/公告日1985-11-05

    原文格式PDF

  • 申请/专利权人 HONEYWELL INC.;

    申请/专利号US19840674903

  • 申请日1984-11-26

  • 分类号H01L21/205;

  • 国家 US

  • 入库时间 2022-08-22 07:51:44

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