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CREAMY SOLDER FEEDING METHOD FOR LEAD FRAME

机译:铅框架的冷焊补料方法

摘要

PURPOSE:To feed creamy solder to the clamp parts of a lead frame at a high speed and at a constant feeding quantity, by contacting the clamp parts of the tips of lead terminals of the lead frame with the creamy solder, which is continuously applied on the surface of a roller at a specified thickness, and scraping the creamy solder. CONSTITUTION:Creamy solder 4 is continuously applied on the surface of a rotating roller 11. Clamp parts 2a of the tips of lead terminals 2 of a lead frame 1 are contacted with the creamy solder 4 on the surface of the roller 11, and the creamy solder 4 is scraped. Thus, the creamy solder 4 is applied on the clamp parts 2a. For example, the creamy solder 4 is supplied in a groove 13, which is formed between the first roller 11 and a second roller 12, which are driven and rotated at a constant speed in the reverse direction to each other. The creamy solder 4 is attached to the surface of the first roller 11. The thickness of the attached solder is controlled at a constant value with a doctor blade 14. Under this state the lead frame is inclined and advanced toward the first roller 11. The clamp part 2a of the tips of the lead terminals 2 are sequentially contacted with the surface of the first roller 11. Thus the creamy solder 4 on the surface of the first roller 11 is scraped.
机译:目的:通过使乳脂状的焊料连续接触引线框的引线端子尖端的夹持部分与乳状焊料,以高速且恒定的进料量将乳状焊料注入引线框架的夹持部分。在指定厚度的辊子表面上刮擦乳状焊料。构成:在旋转辊11的表面上连续施加粘性焊料4。引线框架1的引线端子2的尖端的夹持部分2a与辊11上的乳状焊料4接触,并且乳状刮擦了焊料4。因此,将奶油状焊料4施加在夹持部2a上。例如,将膏状焊料4供应到形成在第一辊11和第二辊12之间的凹槽13中,凹槽13以恒定的速度沿彼此相反的方向被驱动和旋转。乳状焊料4附着到第一辊11的表面。附着的焊料的厚度用刮刀14控制为恒定值。在这种状态下,引线框架倾斜并向第一辊11前进。引线端子2的末端的夹持部2a依次与第一辊11的表面接触。因此,刮擦了第一辊11的表面上的乳状焊料4。

著录项

  • 公开/公告号JPS62154765A

    专利类型

  • 公开/公告日1987-07-09

    原文格式PDF

  • 申请/专利权人 MURATA MFG CO LTD;

    申请/专利号JP19850294604

  • 发明设计人 TAKAHASHI TAKESHI;TABUCHI MAKOTO;

    申请日1985-12-27

  • 分类号B23K3/06;H01L21/48;H01L23/50;

  • 国家 JP

  • 入库时间 2022-08-22 07:25:21

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