首页> 外国专利> METHOD AND APPARATUS FOR FORMING PROTECTIVE FILM OF CLEAN SUBSTRATE IN FORMING MOLECULAR BEAM EPITAXIALLY GROWN LAYER

METHOD AND APPARATUS FOR FORMING PROTECTIVE FILM OF CLEAN SUBSTRATE IN FORMING MOLECULAR BEAM EPITAXIALLY GROWN LAYER

机译:形成分子束表观生长层的清洁基质保护膜的形成方法和装置

摘要

PURPOSE:To prevent a growing chamber from contaminating and a raw material to be deposited from early consuming by generating ionized particles in a substrate pretreating chamber, heating the substrate while exposing with the particles, cleaning to remove impurity substances, and then lowering the temperature of the substrate to adhere and accumulate component elements of the particles on the cleaned surface of the substrate to form a protective film. CONSTITUTION:Etched substrates are fusion-bonded to a substrate holder with a low melting point metal, and the substrates 7a-7f are contained in a substrate pretreating chamber formed of vacuum vessels. Then, an evaporation source is heated in the chamber to evaporate the raw material to be evaporated, the substance is heated to ionize the substance, and ionized particles 6 are irradiated toward the substrates. Thus, the substrates are heated at approx. 650 deg.C while exposing with the particles 6. The substrates are effectively cleaned by heating the substrates. Then, after the substrates are completely cleaned, the heating temperature of the substrates is lowered in the chamber. The particles are adhered and accumulated on the cleaned substrates by the temperature drop to form an amorphous protective film. When the protective film is adhered by 1mum or larger, the substrate is moved to a crystal growing chamber.
机译:目的:通过在基板预处理室中产生离子化的粒子,在暴露粒子的同时加热基板,进行清洗以去除杂质物质,然后降低其温度,以防止生长室被污染并提前消耗待沉积的原材料。使基材粘附并在基材的清洁表面上积聚颗粒的组成元素,以形成保护膜。组成:蚀刻后的基板用低熔点金属熔合到基板支架上,基板7a-7f容纳在由真空容器形成的基板预处理室中。然后,在腔室中加热蒸发源以蒸发要蒸发的原料,加热物质以使该物质离子化,并向基板照射离子化的粒子6。因此,将基板加热到约200℃。在650℃下暴露于颗粒6。通过加热基材有效地清洁基材。然后,在基板被完全清洁之后,基板在腔室中的加热温度降低。通过温度下降,颗粒粘附并积聚在清洁的基板上,从而形成非晶保护膜。当将保护膜粘附1μm或更大时,基板被移至晶体生长室。

著录项

  • 公开/公告号JPS6273705A

    专利类型

  • 公开/公告日1987-04-04

    原文格式PDF

  • 申请/专利权人 ANELVA CORP;

    申请/专利号JP19850213940

  • 申请日1985-09-27

  • 分类号C23C14/02;C30B23/08;H01L21/203;H01L21/26;H01L21/314;

  • 国家 JP

  • 入库时间 2022-08-22 07:22:24

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